Xiaomi yesterday introduced the new flagship Mi 5. The test results of the new smartphone are impressive, but now is not about that. In this article, we will show the process of disassembling a new product that was presented less than 24 hours ago.
So, let’s take a look at what the company has used inside its latest flagship smartphone.
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1. First of all, you need to dismantle the tray for two SIM cards.
Mi 5 does not have a removable back cover, so you have to use a suction cup to remove it.
After you remove the 3D ceramic back cover, you can proceed to unscrew several screws. These screws are covered with stickers, which means you will lose the official warranty as soon as these stickers are removed.
After the screws are loosened, plastic covers can be removed above and below the battery. The photo also shows where the smartphone is NFC.
The smartphone comes with a 3000 mAh compact lithium-ion polymer battery. You can replace it without much hassle, but it will also void the warranty.
The top circuit board in the right places is supported by a metal frame. The processor is covered with thermal grease and, as you can see in the photo, the smartphone manufacturer did not make any additional movements to cool the processor.
Qualcomm seems to have done an excellent job in the Snapdragon 820 in terms of heat dissipation efficiency.
In the photo below – camera blocks. On the left is the 16MP IMX298 sensor from Sony with 4-Axis image stabilization. On the right is a 4 megapixel sensor, UltraPixel is a front camera.
At the bottom of the USB Type-C in Mi 5.
Next, we look at the physical Home button, an integrated fingerprint scanner (unfortunately, the photo does not disclose information about the manufacturer of this sensor).
Close-up Synaptics IC – touch controller.
Snapdragon 820 processor with 4 GB of RAM.
128 GB flash memory, which uses the latest UFS 2.0 standard, is faster and more efficient than EMMC 5.0.
Somehow unexpectedly, but that’s all.
As you can see from the photographs, in Mi 5 all components are optimally located, given the thickness of the device is only 7.25 mm.